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  • ATS-18D-06-C3-R0

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    ## Technical Overview: ATS-18D-06-C3-R0 The **ATS-18D-06-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for high-velocity airflow environments to cool electronic components like CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications The part is defined by its physical geometry and thermal performance characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Flow Pattern** | maxiFLOW (Tapered Fin) | | **Thermal Resistance** | 20.27 °C/W @ (Natural Convection) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 6.00mm | --- ### 2. Physical Design & Engineering The "Electronic Parts" aspect of this device refers to its structural engineering used to manage heat in sensitive circuitry: * **Tapered Fin Design:** The maxiFLOW™ design features a flared fin structure. This increases the surface area while minimizing pressure drop, allowing more air to flow through the center of the sink. * **pushPIN™ Attachment:** The "-R0" suffix indicates a specific attachment kit. This system uses a brass or plastic pin with a stainless steel spring to provide a precise, consistent compression force (TIM - Thermal Interface Material pressure) against the chip. * **Low Profile:** With a height of only **6.00mm**, this part is intended for high-density electronic assemblies where vertical space is limited (e.g., 1U servers or networking switches). --- ### 3. Thermal Performance Metrics Thermal resistance measures how effectively the part moves heat away from the silicon die. Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 11.77 | | 400 | 2.0 | 5.91 | | 600 | 3.0 | 4.21 | | 800 | 4.0 | 3.37 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18D:** Series/Base geometry. * **06:** Height in millimeters (6.0mm). * **C3:** Material/Finish code (typically refers to specific thermal interface requirements or blue anodization). * **R0:** Packaging and Hardware kit designation. ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN attachment system?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does the maxiFLOW fin design compare to standard cross-cut heat sinks?