ATS-18D-06-C3-R0
AI

## Technical Overview: ATS-18D-06-C3-R0
The **ATS-18D-06-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for high-velocity airflow environments to cool electronic components like CPUs, GPUs, and power modules.
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### 1. Key Technical Specifications
The part is defined by its physical geometry and thermal performance characteristics:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Flow Pattern** | maxiFLOW (Tapered Fin) |
| **Thermal Resistance** | 20.27 °C/W @ (Natural Convection) |
| **Dimensions (L x W)** | 45.00mm x 45.00mm |
| **Height** | 6.00mm |
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### 2. Physical Design & Engineering
The "Electronic Parts" aspect of this device refers to its structural engineering used to manage heat in sensitive circuitry:
* **Tapered Fin Design:** The maxiFLOW™ design features a flared fin structure. This increases the surface area while minimizing pressure drop, allowing more air to flow through the center of the sink.
* **pushPIN™ Attachment:** The "-R0" suffix indicates a specific attachment kit. This system uses a brass or plastic pin with a stainless steel spring to provide a precise, consistent compression force (TIM - Thermal Interface Material pressure) against the chip.
* **Low Profile:** With a height of only **6.00mm**, this part is intended for high-density electronic assemblies where vertical space is limited (e.g., 1U servers or networking switches).
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### 3. Thermal Performance Metrics
Thermal resistance measures how effectively the part moves heat away from the silicon die. Performance varies based on air velocity (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 11.77 |
| 400 | 2.0 | 5.91 |
| 600 | 3.0 | 4.21 |
| 800 | 4.0 | 3.37 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variations:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **18D:** Series/Base geometry.
* **06:** Height in millimeters (6.0mm).
* **C3:** Material/Finish code (typically refers to specific thermal interface requirements or blue anodization).
* **R0:** Packaging and Hardware kit designation.
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- ⤷
What are the compatible PCB hole patterns for the pushPIN attachment system?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How does the maxiFLOW fin design compare to standard cross-cut heat sinks?