The **ATS-18D-07-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **heat sink** designed for cooling integrated circuits (ICs), particularly BGA (Ball Grid Array) components. --- ## 1. Core Specifications The part number follows a specific nomenclature that defines its dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Passive Cooling / Heat Sinks | | **Fin Style** | Push-Pin (Straight Fin) | | **Material** | Aluminum (Black Anodized) | | **Base Dimensions** | 45.00mm x 45.00mm | | **Height** | 12.70mm | | **Attachment Method** | Push-Pin with Brass Spring | --- ## 2. Thermal Performance The primary function of this part is to dissipate heat away from a semiconductor. The effectiveness is measured by **Thermal Resistance** (°C/W); the lower the value, the better the cooling. * **Airflow at 200 LFM (Linear Feet per Minute):** ~1.70°C/W * **Airflow at 500 LFM:** ~1.10°C/W * **Heat Transfer:** Designed for high-velocity airflow environments (server racks, industrial controllers). --- ## 3. Mounting Mechanism (Push-Pin) One of the defining "electronic parts" of this assembly is the mounting hardware. Unlike adhesive-based heat sinks, the `-R0` suffix indicates a mechanical attachment: 1. **Push-Pins:** Molded plastic pins that snap into pre-drilled holes on the PCB (Printed Circuit Board). 2. **Compression Springs:** Provides consistent pressure (clamping force) on the chip to ensure maximum contact with the thermal interface. 3. **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766** phase-change material or similar, which fills microscopic gaps between the chip and the aluminum base. --- ## 4. Part Number Breakdown Understanding the code helps in selecting substitutes: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix | | **18D** | Series (Push-Pin Style) | | **07** | Specific height/dimension code | | **C3** | Thermal Interface Material (TIM) type | | **R0** | Revision / Packaging indicator | --- ### Application Usage This component is typically found in: * **Networking:** Routers, switches, and gateways. * **Computing:** High-speed processors and FPGAs. * **Power Electronics:** Voltage regulators requiring compact heat dissipation.