The **ATS-18D-10-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component is part of their "push-pin" series designed for thermal management in electronic systems. --- ### 1. Specifications Overview The part number encodes specific data regarding its size, material, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ | | **Thermal Resistance** | 7.89°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | --- ### 2. Physical Dimensions The dimensions are critical for determining if the heat sink will fit on the Printed Circuit Board (PCB) without interfering with other components. | Dimension | Value (mm) | Description | | :--- | :--- | :--- | | **Length** | 45.00 mm | Horizontal footprint | | **Width** | 45.00 mm | Vertical footprint | | **Height** | 25.00 mm | Fin height (Vertical clearance) | | **Hole Pattern** | 38.00 mm | Distance between mounting holes | --- ### 3. Key Electronic/Thermal Characteristics * **Thermal Management:** It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors, to prevent thermal throttling or hardware failure. * **Fin Profile:** It features a **Straight Fin** design, which is optimized for systems with a clear, directional airflow (forced air cooling). * **C2 Material Grade:** The "C2" designation typically refers to the thermal interface material (TIM) or the specific aluminum alloy grade used, ensuring high conductivity. * **R0 Requirement:** The "R0" suffix confirms the product is RoHS (Restriction of Hazardous Substances) compliant, meaning it does not contain lead or other restricted environmental toxins. --- ### 4. Mounting Mechanism The **Push-Pin** system is a mechanical mounting solution that: 1. Uses pre-drilled holes in the PCB. 2. Provides consistent pressure on the component via a compression spring. 3. Allows for quick installation and ensures the heat sink remains in contact with the chip even under vibration.