## Technical Overview of ATS-18D-100-C2-R0 The **ATS-18D-100-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating semiconductors. --- ### 1. General Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18D-100-C2-R0 | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | --- ### 2. Design and Engineering Features The part number indicates specific design choices meant for high-efficiency cooling in constrained spaces: * **Heat Sink Profile (Fin Design):** This model typically utilizes a **Straight Fin** or **Cross-Cut** design. This allows for airflow from multiple directions, making it suitable for systems where the airflow path might be turbulent. * **Push-Pin Attachment:** The "pushPIN™" system provides a standardized mounting mechanism. It uses a spring-loaded pin that passes through pre-drilled holes in the PCB, ensuring a precise and consistent pressure on the component (TIM compression). * **Thermal Interface Material (TIM):** The "-C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase change material** or a high-performance grease. This eliminates the need for manual application and ensures minimal thermal resistance between the chip and the aluminum. * **Material Efficiency:** Made from Aluminum (AL6063), it balances lightweight properties with high thermal conductivity. The blue anodized finish increases surface emissivity and protects against corrosion. --- ### 3. Thermal Performance (Estimated) Thermal resistance is the measure of how well the heat sink can dissipate heat. Values vary based on the Air Velocity (LFM - Linear Feet per Minute): | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~4.80 | | 200 (1.0 m/s) | ~2.50 | | 400 (2.0 m/s) | ~1.60 | --- ### 4. Component Breakdown The assembly consists of three main electronic/mechanical elements: 1. **Heat Sink Body:** The primary radiator surface. 2. **Brass/Plastic Push-Pins:** The mechanical fasteners. 3. **Compression Springs:** These maintain the specific "Force" required to keep the heat sink in contact with the electronic chip during vibration or thermal expansion. ---