ATS-18D-128-C2-R0
AI

The **ATS-18D-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## Technical Specifications
The following table outlines the physical and thermal properties of this specific part number:
| Specification | Value |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Thermal Resistance** | 2.91°C/W (at 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Dimensions (L x W x H)** | 54mm x 54mm x 25mm |
| **Fin Style** | Fine Pitch (Cross-Cut) |
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## Component Breakdown
### 1. Attachment Mechanism (Push-Pin)
This part uses a **Push-Pin** system with a brass or plastic pin and a compression spring. This ensures:
* **High Reliability:** Constant pressure is applied to the heat source.
* **Ease of Assembly:** Can be installed manually or with basic tools through pre-drilled holes in the PCB.
### 2. Fin Geometry
The "D" in the part number often signifies a specific fin density and arrangement. This heatsink utilizes a **Cross-Cut** fin design:
* **Omnidirectional Airflow:** Unlike straight-fin heatsinks, this design allows air to enter from any direction, making it ideal for enclosures with complex internal airflow.
* **Surface Area:** The high fin density maximizes the area available for heat transfer to the ambient air.
### 3. Thermal Interface Material (TIM)
The part comes pre-applied with **ATS-PPS-11**, a high-performance thermal interface material. This fills the microscopic air gaps between the chip and the heatsink base, significantly reducing thermal resistance.
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## Part Number Decoder
To understand the specific configuration of this part:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **18D** | Series and Fin Pattern (Cross-Cut) |
| **128** | Size / Height Configuration |
| **C2** | Color/Material (Aluminum, Blue Anodized) |
| **R0** | RoHS Compliant / Revision code |
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## Typical Applications
* **Telecom Equipment:** High-speed routers and switches.
* **Embedded Computing:** Industrial PC processors.
* **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.
- ⤷What is the difference between push-pin and adhesive mounting for heatsinks?
- ⤷ How does 'LFM' affect the thermal resistance of this part?
- ⤷ Can this heatsink be used on a chip smaller than its 54x54mm base?