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  • ATS-18D-131-C2-R0

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    The **ATS-18D-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient thermal management of electronic components like CPUs, GPUs, or power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-18D-131-C2-R0 | | **Material** | Aluminum (Body), Copper (optional variants, but usually Al for this series) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.60°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 20.00mm | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### Key Design Features 1. **Fin Profile (Fine-Pitch):** The "131" designation typically refers to a specific fin density and geometry. This model utilizes a **Straight Fin** pattern, which allows for low-pressure drop and is ideal for systems with high-velocity airflow. 2. **PushPIN™ Attachment:** Instead of using messy adhesives or simple clips, this uses a spring-loaded pin mechanism. * Ensures consistent pressure across the component surface. * Prevents accidental detachment during shipping or vibration. * Available in different spring strengths (this model uses a brass/steel spring). 3. **Blue Anodized Finish:** The coating isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. 4. **Pre-applied TIM:** It comes with **T766 thermal interface material** pre-applied to the base, ensuring optimal thermal contact with the electronic chip right out of the box. --- ### Thermal Performance Overview Performance varies based on airflow (measured in Linear Feet per Minute - LFM): * **@100 LFM (0.5 m/s):** 3.60 °C/W * **@200 LFM (1.0 m/s):** 2.26 °C/W * **@400 LFM (2.0 m/s):** 1.61 °C/W --- ### Typical Applications * **Networking Equipment:** Switches and Routers. * **Embedded Systems:** Industrial PCs and motherboards. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 versions of this heat sink?
    • ⤷ How do I calculate the correct LFM for my specific cooling fan?
    • ⤷ Are there alternative attachment methods if the PCB doesn't have pushPIN holes?