ATS-18D-131-C2-R0
AI

The **ATS-18D-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient thermal management of electronic components like CPUs, GPUs, or power transistors.
### Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-18D-131-C2-R0 |
| **Material** | Aluminum (Body), Copper (optional variants, but usually Al for this series) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 3.60°C/W (at 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 20.00mm |
| **TIM (Thermal Interface Material)** | T766 (High Performance) |
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### Key Design Features
1. **Fin Profile (Fine-Pitch):**
The "131" designation typically refers to a specific fin density and geometry. This model utilizes a **Straight Fin** pattern, which allows for low-pressure drop and is ideal for systems with high-velocity airflow.
2. **PushPIN™ Attachment:**
Instead of using messy adhesives or simple clips, this uses a spring-loaded pin mechanism.
* Ensures consistent pressure across the component surface.
* Prevents accidental detachment during shipping or vibration.
* Available in different spring strengths (this model uses a brass/steel spring).
3. **Blue Anodized Finish:**
The coating isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer.
4. **Pre-applied TIM:**
It comes with **T766 thermal interface material** pre-applied to the base, ensuring optimal thermal contact with the electronic chip right out of the box.
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### Thermal Performance Overview
Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
* **@100 LFM (0.5 m/s):** 3.60 °C/W
* **@200 LFM (1.0 m/s):** 2.26 °C/W
* **@400 LFM (2.0 m/s):** 1.61 °C/W
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### Typical Applications
* **Networking Equipment:** Switches and Routers.
* **Embedded Systems:** Industrial PCs and motherboards.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
- ⤷What is the difference between the C1
- ⤷ C2
- ⤷ and C3 versions of this heat sink?
- ⤷ How do I calculate the correct LFM for my specific cooling fan?
- ⤷ Are there alternative attachment methods if the PCB doesn't have pushPIN holes?