The **ATS-18D-145-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed specifically for cooling electronic components like BGA (Ball Grid Array) packages. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | superGRIP™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Attachment Method** | Clip-on (superGRIP Frame) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics This component is engineered for modern high-density PCB layouts where space is limited and thermal loads are high. * **Fins:** It features a **Straight-Fin** design. This allows for optimal airflow in a single direction, making it highly efficient when placed in the path of a system fan. * **Attachment Mechanism:** The `superGRIP` technology uses a plastic frame clip that attaches to the component without requiring holes in the PCB. This prevents mechanical stress on the solder joints. * **Thermal Interface Material (TIM):** It comes with **T766** phase-change material pre-applied. This ensures low thermal resistance between the chip surface and the aluminum base. --- ### 3. Application Use Cases The ATS-18D-145-C2-R0 is typically used for cooling the following electronic parts: 1. **Microprocessors/CPUs:** Low-power embedded processors. 2. **FPGAs (Field Programmable Gate Arrays):** High-speed logic chips that generate significant heat. 3. **ASICs:** Application-specific integrated circuits in networking or telecommunications equipment. 4. **GPUs:** Small-scale graphics or image processors. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.91 | | 400 | 2.0 | 1.93 | | 600 | 3.0 | 1.55 | ---