The **ATS-18D-157-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance (Unducted)** | 3.35 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.99 °C/W @ 100 LFM | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **18D:** Series identification. * **157:** Specific model/size reference (40mm square). * **C2:** Material/Finish code (typically refers to Aluminum with a Blue Anodize). * **R0:** Revision code or packaging indicator. --- ### 3. Key Electronic/Mechanical Features #### A. Attachment Mechanism (pushPIN™) The "pushPIN™" system uses a flexible spring-loaded mechanism. This is superior to standard adhesive tapes because: * It provides **consistent pressure** across the component, improving thermal transfer. * It allows for **easy installation and removal** without damaging the PCB. * The springs are available in various tensions to meet specific mechanical requirements. #### B. Thermal Performance The "Straight Fin" design is optimized for high-performance cooling. The **Blue Anodized** finish is not just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat emission. #### C. Component Compatibility Because of its 40mm x 40mm footprint, it is commonly used for: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). --- ### 4. Thermal Resistance Reference | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **°C/W (Unducted)** | 3.35 | 2.02 | 1.62 | 1.41 | 1.28 | ---