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  • ATS-18D-169-C2-R0

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    The **ATS-18D-169-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 10mm | | **Fin Type** | Cross-Cut (Pin Fin) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | 15.71°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The "169" series features a **cross-cut fin design**. Unlike straight fins, these "pins" increase surface area and allow for omnidirectional airflow, making it ideal for systems where the direction of the cooling air may vary. #### B. Mounting Mechanism (Push-Pin) This part uses a **Brass Push-Pin** system. * **Ease of Install:** Allows for quick, tool-free installation into pre-drilled holes in the PCB. * **Pressure:** The included springs provide a specific amount of "downward force" (compression), ensuring the heat sink makes firm contact with the chip for maximum heat transfer. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a "Phase Change" material that softens and flows as the component heats up, filling microscopic air gaps between the chip and the aluminum base. --- ### 3. Part Number Decoding The suffix "C2-R0" indicates specific finishes and materials: * **C2:** Refers to the Blue Anodized finish, which provides better radiative heat transfer and corrosion resistance. * **R0:** Indicates the standard revision and compliance with environmental standards (RoHS). --- ### 4. Application Usage This part is commonly found in: * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and small form factor (SFF) boards. * **Automotive:** Control modules and sensors requiring rugged mounting.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required for this push-pin heat sink?
    • ⤷ How does the T766 phase change material compare to standard thermal grease?
    • ⤷ What are the specific thermal resistance values at different airflow speeds (LFM)?