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The **ATS-18D-169-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number provides specific details about its dimensions, material, and thermal performance.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 30mm x 30mm x 10mm |
| **Fin Type** | Cross-Cut (Pin Fin) |
| **Attachment Method** | Push-Pin (Brass) with Compression Spring |
| **Thermal Resistance** | 15.71°C/W (at 200 LFM) |
| **Thermal Interface (TIM)** | T766 (High Performance Phase Change) |
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### 2. Detailed Component Breakdown
#### A. The Heat Sink Body
The "169" series features a **cross-cut fin design**. Unlike straight fins, these "pins" increase surface area and allow for omnidirectional airflow, making it ideal for systems where the direction of the cooling air may vary.
#### B. Mounting Mechanism (Push-Pin)
This part uses a **Brass Push-Pin** system.
* **Ease of Install:** Allows for quick, tool-free installation into pre-drilled holes in the PCB.
* **Pressure:** The included springs provide a specific amount of "downward force" (compression), ensuring the heat sink makes firm contact with the chip for maximum heat transfer.
#### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. This is a "Phase Change" material that softens and flows as the component heats up, filling microscopic air gaps between the chip and the aluminum base.
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### 3. Part Number Decoding
The suffix "C2-R0" indicates specific finishes and materials:
* **C2:** Refers to the Blue Anodized finish, which provides better radiative heat transfer and corrosion resistance.
* **R0:** Indicates the standard revision and compliance with environmental standards (RoHS).
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### 4. Application Usage
This part is commonly found in:
* **Networking Hardware:** Routers, switches, and modems.
* **Embedded Systems:** Industrial PCs and small form factor (SFF) boards.
* **Automotive:** Control modules and sensors requiring rugged mounting.
- ⤷
What is the hole-to-hole spacing required for this push-pin heat sink?
- ⤷ How does the T766 phase change material compare to standard thermal grease?
- ⤷ What are the specific thermal resistance values at different airflow speeds (LFM)?