The **ATS-18D-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 15.44 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.18 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Pitch / Fin Pattern** | Fine Pitch (COARSE-PITCH) | --- ### 2. Electronic Component Breakdown #### A. Thermal Management (Heat Dissipation) This part is a **passive cooling** component. In electronics, heat is the primary cause of component failure. The ATS-18D-17-C2-R0 increases the surface area of the heat-generating chip, allowing ambient air to carry the thermal energy away via convection. #### B. The pushPIN™ System Unlike adhesive tapes or simple clips, the "pushPIN" mechanism used here ensures: * **Constant Pressure:** A high-performance compression spring provides uniform pressure across the Thermal Interface Material (TIM). * **Reliability:** It prevents the heatsink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The **"C2"** in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal grease. This is a critical "electronic part" of the assembly that fills microscopic air gaps between the semiconductor and the aluminum heatsink to improve heat transfer. --- ### 3. Application Use Cases This specific heatsink is typically found in: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and power converters that require compact but efficient cooling. ---