The **ATS-18D-173-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 4.72°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance planning. * **Length (A):** 30.00 mm * **Width (B):** 30.00 mm * **Height (C):** 30.00 mm * **Pitch (E):** 35.00 mm (Distance between push-pins) * **Weight:** ~46 grams --- ## 3. Key Electronic Design Features ### A. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat or vibration, this part uses a mechanical push-pin system. This ensures consistent pressure across the component surface, which optimizes thermal transfer. ### B. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills microscopic air gaps between the chip and the heat sink base, significantly reducing thermal impedance. ### C. Fin Profile (Cross-Cut) The "173" designation refers to a specific fin pattern. This heat sink uses a **cross-cut** or "pin fin" style design. This allows for multi-directional airflow, making it effective in systems where the cooling fan direction might vary or where airflow is turbulent. ### D. Material Conductivity Constructed from **Aluminum 6063**, the part balances high thermal conductivity with low weight, preventing mechanical stress on the PCB. --- ## 4. Usage Considerations To implement this part in an electronic design, engineers must ensure: 1. **Hole Pattern:** The PCB must have two 3.0mm holes spaced 35.00mm apart to accommodate the push-pins. 2. **Vertical Clearance:** A 30mm height is relatively tall for low-profile server blades; ensure there is no mechanical interference with chassis lids. 3. **Airflow Velocity:** Performance improves drastically as LFM (Linear Feet per Minute) increases. At 100 LFM the resistance is 4.72°C/W, but it drops significantly at 400+ LFM.