The **ATS-18D-174-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Board Level, Square Fin | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.02°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 30mm x 30mm x 35mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Features #### 1. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, the "pushPIN™" system uses a flexible, spring-loaded plastic pin. * **Benefit:** Provides consistent pressure on the processor, improving thermal transfer. * **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal expansion. #### 2. Fin Design (Cross-Cut) The unit features a **straight fin/square** pattern. This design is optimized for environments where airflow may be inconsistent, as it allows air to pass through the fins from multiple directions (omnidirectional). #### 3. Material and Coating * **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiation heat transfer. #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip, significantly lowering thermal resistance. --- ### Typical Applications This specific heat sink is commonly used on: * **CPUs/GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **Telecommunications** hardware. * **Power Supplies** that require vertical clearance (due to its 35mm height). ---