ATS-18D-175-C2-R0
AI

The **ATS-18D-175-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the **push-pin** attachment series designed for cooling integrated circuits (ICs) and PCBs.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 35mm x 35mm x 10mm |
| **Attachment Type** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 13.52°C/W (Unducted Flow @ 200 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Design and Components
The part is engineered for reliability in high-speed data environments:
* **Heat Sink Body:** Constructed from extruded aluminum for lightweight and efficient heat dissipation. The **Blue Anodized** finish provides surface protection and high emissivity.
* **Attachment Mechanism:** Uses a **Push-Pin** system with a specific hole pattern. This ensures consistent pressure on the heat source, improving the effectiveness of the interface material.
* **Thermal Interface Material (TIM):** It typically comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink.
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### 3. Application Use Cases
The ATS-18D-175-C2-R0 is commonly found in the following electronic systems:
1. **Telecommunications:** Cooling of high-speed processors in routers and switches.
2. **Embedded Systems:** Industrial PCs where vertical space (10mm height) is limited.
3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.
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### 4. Thermal Performance Profile
Thermal resistance varies based on the airflow (velocity) within the chassis:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 13.52 |
| 400 (2.0 m/s) | 7.53 |
| 600 (3.0 m/s) | 5.91 |
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- ⤷
How does the push-pin attachment compare to adhesive mounting?
- ⤷ What are the benefits of the T766 phase-change material?
- ⤷ Can this heat sink be used in a natural convection environment?