The **ATS-18D-183-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal performance. | Specification | Detail | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### 2. Thermal Resistance Performance Thermal resistance indicates how effectively the heat sink dissipates heat into the surrounding air. Lower values represent better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (200 LFM)** | 5.37 | | **Unducted (400 LFM)** | 2.85 | | **Unducted (600 LFM)** | 2.11 | --- ### 3. Key Electronic/Mechanical Features * **Push Pin Attachment:** Unlike adhesive-based heat sinks, this uses a spring-loaded push pin mechanism. This ensures consistent pressure across the chip surface, improving heat transfer and reliability in high-vibration environments. * **Blue Anodized Coating:** The anodized surface is not just for aesthetics; it increases the surface emissivity and protects the aluminum from corrosion. * **Pre-applied TIM:** It comes with **T766 thermal phase-change material**. This simplifies the assembly process on a production line and ensures an even layer of thermal interface between the component and the heat sink. * **Fine Pitch Fins:** The straight-fin design is optimized for environments where there is a dedicated fan or directional airflow (forced convection). --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Cooling MOSFETs or power regulators. * **Computing:** Secondary cooling for chipsets or peripheral processors.