The **ATS-18D-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance (Unducted)** | 18.11 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Weight** | 10.32 grams | --- ### 2. Part Number Breakdown (Nomenclature) The part number follows a specific logic used by ATS to identify the component's features: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **18D**: Series identifier (Standard heat sink series). * **196**: Fin pattern/design configuration. * **C2**: Thermal interface material (TIM) or specific coating (usually implies a high-performance pre-applied pad). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic/Mechanical Features ### A. Thermal Efficiency This heat sink uses a **cross-cut fin design**, which increases surface area and allows for multi-directional airflow. This is critical for electronic enclosures where the direction of the cooling fan's exhaust might vary. ### B. Push-Pin Attachment The component uses a **Push-Pin** mechanism rather than adhesive or screws. * **Compression Spring:** Ensures constant pressure between the heat sink and the electronic component. * **Ease of Installation:** Allows for quick mounting on PCBs with pre-drilled holes (usually 3.0mm diameter). ### C. Thermal Interface Material (TIM) The "C2" designation typically indicates that the part comes with a **pre-applied thermal pad**. This eliminates the need for manual application of thermal paste, ensuring a uniform thermal bond and reducing the risk of air pockets that can lead to component overheating. --- ### 4. Ideal Applications This part is commonly used in: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power transistors that generate localized heat.