The **ATS-18D-201-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 50mm x 50mm x 10mm | | **Thermal Resistance** | 8.17°C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | | **Compliance** | RoHS / REACH | --- ### 2. Key Components & Construction #### A. The Heat Sink Body * **Material:** Made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. * **Fin Profile:** Features a **Straight Fin** design. This is optimized for high-performance air cooling where there is a consistent flow of air (forced convection) from a system fan. * **Coating:** The "C2" in the part number indicates a **Blue Anodized** finish. This coating provides corrosion resistance and increases surface emissivity, slightly improving radiation cooling. #### B. The Attachment System (Push-Pins) * **Mechanism:** It uses a spring-loaded push-pin mechanism. This ensures a consistent downward pressure (clamping force) on the electronic chip, which is critical for maintaining contact with the thermal interface material. * **Material:** Usually high-durability plastic pins with stainless steel springs. #### C. Thermal Interface Material (TIM) * The **R0** suffix typically denotes that the unit comes pre-applied with **ATS-specific phase-change material** or a high-performance thermal pad. This fills the microscopic air gaps between the chip and the heat sink base to maximize heat transfer. --- ### 3. Electronic Application Use-Case This part is typically used on high-density Printed Circuit Boards (PCBs) where thermal throttling must be avoided. * **Primary Goal:** To lower the junction temperature ($T_j$) of a semiconductor. * **Compatibility:** Designed for holes in the PCB spaced according to specific industry standards (often 43mm or similar diagonal patterns). ---