The **ATS-18D-202-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 15.00 mm | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | ATS-HK176-R0 | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. Material and Design * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodization:** Not only provides an aesthetic finish but also increases surface emissivity and protects the aluminum from corrosion. * **Fine Pitch Fins:** The "18D" series typically features a specific fin density designed to balance airflow resistance (pressure drop) and surface area for heat dissipation. ### B. The Push-Pin Mechanism This part uses a mechanical attachment system consisting of: 1. **Plastic Push-Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). 2. **Compression Springs:** These provide precise vertical pressure (clamping force) on the electronic component to ensure maximum contact with the heat sink. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ## 3. Performance Metrics The thermal resistance (measured in °C/W) depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: * **Unducted Flow:** Higher resistance (less cooling) because air can escape the sides. * **Ducted Flow:** Lower resistance (better cooling) as air is forced directly through the fins. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18D** | Series / Fin Design Type | | **202** | Dimensions / Height Identifier | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision / RoHS Compliance Status |