The **ATS-18D-208-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling electronic components such as CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Base Dimensions** | 70mm x 70mm | | **Height** | 10mm | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ## 2. Key Components & Electronics Integration ### A. Material and Thermal Dissipation The unit is crafted from high-grade aluminum. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, allowing for better heat radiation and providing a layer of protection against corrosion and electrical conductivity at the surface. ### B. Attachment Mechanism (Push Pins) Instead of adhesive tapes, this model uses a mechanical push-pin system. * **Pressure:** Ensures uniform contact between the heat sink base and the electronic chip. * **Reliability:** Mechanical fasteners are preferred in high-vibration environments where thermal tape might fail. ### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied **Thermal Interface Material**. This material fills microscopic air gaps between the component (like a processor) and the heat sink base to maximize heat transfer. --- ## 3. Physical Dimensions Effective space management is critical in PCB design. Below are the dimensions for board layout planning: | Dimension | Value (mm) | | :--- | :--- | | **Length (L)** | 70.00 mm | | **Width (W)** | 70.00 mm | | **Height (H)** | 10.00 mm | | **Pin Pitch (P1)** | 63.00 mm | --- ## 4. Performance Data (Airflow) The efficiency of this heat sink depends on the Linear Feet per Minute (LFM) of airflow provided by system fans: * **Unducted Flow:** 6.69 °C/W @ 200 LFM * **Ducted Flow:** 3.48 °C/W @ 300 LFM * **High Performance:** 2.30 °C/W @ 600 LFM