The **ATS-18D-24-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **push-pin heat sink** series, designed primarily for cooling Integrated Circuits (ICs) like BGA, FPGA, and CPUs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.88°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions Precision is critical for board layout and component clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height (Fin Height):** 25.00 mm * **Pin-to-Pin Distance:** 33.00 mm --- ## 3. Fin Design: "maxiFLOW™" The **ATS-18D-24-C2-R0** uses a specialized fin geometry known as **maxiFLOW™**. * **Structure:** It features a flared fin structure. * **Benefit:** This design maximizes the surface area for convective heat transfer while minimizing the pressure drop. It is highly effective in environments where airflow is limited or constrained. * **Airflow:** Designed for high-performance thermal management in systems with steady air movement. --- ## 4. Part Number Decoder Understanding the "C2-R0" suffix is important for procurement and assembly: * **C2:** Refers to the **Blue Anodized** finish. Anodizing increases corrosion resistance and provides a slight improvement in thermal emissivity. * **R0:** Indicates the specific revision or packaging standard provided by the manufacturer. * **18D:** Refers to the specific series within the ATS catalog. --- ## 5. Applications Typical use cases for this specific heat sink include: 1. **Telecommunications:** Cooling of network switches and routers. 2. **Computing:** Heat dissipation for high-speed processors on motherboards. 3. **Industrial:** Thermal management for power modules in automation controllers.