## Technical Overview of ATS-18D-26-C2-R0 The **ATS-18D-26-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components, specifically integrated circuits (ICs) like processors, FPGAs, and ASICs. ### 1. General Specifications This part is categorized as a thermal management component. Below are the primary physical and performance metrics: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (STS) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the footprint of the PCB and does not interfere with surrounding components. * **Size (L x W):** 70mm x 70mm * **Height:** 10mm (Low Profile) * **Pitch (Fin Spacing):** Fine-pitch straight fin design for optimized airflow. * **Hole Pattern:** Standardized push-pin spacing for secure mounting. --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance (expressed in °C/W). Lower values indicate better cooling. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@ 100 LFM (0.5 m/s)** | 14.20 °C/W | | **@ 200 LFM (1.0 m/s)** | 5.25 °C/W | | **@ 500 LFM (2.5 m/s)** | 2.50 °C/W | --- ### 4. Component Breakdown The part consists of four main electronic/mechanical sub-parts: 1. **Aluminum Fin Array:** A high-surface-area block that transfers heat from the component to the ambient air. 2. **Push Pins:** Brass components that pass through the PCB to lock the heat sink in place. 3. **Compression Springs:** Provide consistent downward pressure (clamping force) to ensure maximum contact between the heat sink and the chip. 4. **Thermal Interface Material (T766):** A phase-change or conductive pad pre-applied to the bottom to fill microscopic air gaps between the heat sink and the electronic component. --- ### 5. Application Use Cases * **Telecommunications:** Used in routers and switches where low-profile cooling is required. * **Industrial PCs:** Cooling for embedded processors. * **Power Supplies:** Dissipating heat from high-power transistors or voltage regulators.