Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18D-32-C3-R0

  • AI
    The **ATS-18D-32-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W)** | 57.58mm x 56.90mm | | **Height (Fin)** | 12.70mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly effective in systems with forced-air cooling. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system: * **Mechanical Stability:** Uses a spring-loaded pin to ensure constant pressure on the processor/chip. * **Reliability:** Provides secure mounting even in high-vibration environments. * **Hardware:** It typically requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. T412 is a high-performance phase-change material that ensures minimal air gaps between the component (CPU/GPU/FPGA) and the heatsink base, maximizing heat transfer. --- ### 3. Applications This specific heatsink is typically used for cooling: * **ASICs and FPGAs:** High-speed integrated circuits in networking hardware. * **Power Supplies:** Heat dissipation for MOSFETs or power modules. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (12.7mm height). --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18D:** Series/Mounting style. * **32:** Specific size/fin configuration. * **C3:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the pushPIN™ mounting on the PCB?
    • ⤷ How does the thermal resistance change at higher air flow rates (LFM)?
    • ⤷ Are there alternative Thermal Interface Materials (TIM) available for this model?