ATS-18D-32-C3-R0
AI

The **ATS-18D-32-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces.
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### 1. Technical Specifications
Below are the primary technical parameters for this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W)** | 57.58mm x 56.90mm |
| **Height (Fin)** | 12.70mm |
| **Thermal Interface Material** | T412 (Pre-applied) |
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### 2. Key Design Features
#### A. Fin Geometry (maxiFLOW™)
The "maxiFLOW" design features a flared fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly effective in systems with forced-air cooling.
#### B. pushPIN™ Attachment
Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system:
* **Mechanical Stability:** Uses a spring-loaded pin to ensure constant pressure on the processor/chip.
* **Reliability:** Provides secure mounting even in high-vibration environments.
* **Hardware:** It typically requires pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The part comes with **T412** pre-applied. T412 is a high-performance phase-change material that ensures minimal air gaps between the component (CPU/GPU/FPGA) and the heatsink base, maximizing heat transfer.
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### 3. Applications
This specific heatsink is typically used for cooling:
* **ASICs and FPGAs:** High-speed integrated circuits in networking hardware.
* **Power Supplies:** Heat dissipation for MOSFETs or power modules.
* **Embedded Systems:** Industrial PCs where vertical clearance is limited (12.7mm height).
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18D:** Series/Mounting style.
* **32:** Specific size/fin configuration.
* **C3:** Material/Finish code (Blue Anodized Aluminum).
* **R0:** Revision/Packaging code.
- ⤷
What is the hole pattern requirement for the pushPIN™ mounting on the PCB?
- ⤷ How does the thermal resistance change at higher air flow rates (LFM)?
- ⤷ Are there alternative Thermal Interface Materials (TIM) available for this model?