The **ATS-18D-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.51°C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. Fin Design: Cross-Cut The "D" in the part number indicates a **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in compact electronic enclosures where air may not flow in a perfectly straight path. ### B. Attachment: pushPIN™ Technology This part uses the ATS proprietary pushPIN™ system. * **Spring-loaded:** It provides a precise amount of pressure on the component to ensure maximum thermal contact. * **Security:** Unlike adhesive tapes, mechanical pins prevent the heat sink from shifting or falling off due to vibration or high temperatures. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ## 3. Decoding the Part Number The part number follows a specific nomenclature that describes its physical properties: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **18D** | Series / Fin Pattern (Cross-cut) | | **45** | 45mm Width/Length | | **C3** | 10mm Height | | **R0** | Revision / Specific Packaging or Coating | --- ## 4. Application Use Cases This specific heat sink is typically used in the following electronic environments: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial motherboards and Single Board Computers (SBCs). * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.