The **ATS-18D-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm | | **Height** | 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.63°C/W @ 100 LFM | | **Fin Pattern** | Square-Cut (Cross-Cut) | --- ### 2. Key Component Breakdown #### A. Fin Design (Square-Cut) The "49" in the series typically refers to the specific fin geometry. The **square-cut fin design** provides a large surface area for heat dissipation. Unlike straight fins, the cross-cut pattern allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan's exhaust might vary. #### B. Attachment Mechanism (Push-Pin & Spring) The part uses a **Brass Push-Pin** with a **Steel Spring**. - **Reliability:** This provides consistent pressure (clamping force) on the high-power component (CPU, GPU, or MOSFET). - **Security:** Unlike adhesive tapes, push-pins ensure the heat sink remains attached during mechanical shock or high-vibration environments. #### C. Material and Coating - **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Thermal Performance Reference Thermal resistance ($\theta_{sa}$) varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 5.63 | | **200 (1.0 m/s)** | 3.25 | | **300 (1.5 m/s)** | 2.50 | | **400 (2.0 m/s)** | 2.10 | --- ### 4. Application Use Cases This specific heat sink is commonly found in: * **Telecommunications:** Cooling small chips on line cards. * **Embedded Systems:** High-speed processors in industrial PCs. * **Power Supplies:** Heat dissipation for localized power conversion components.