The **ATS-18D-71-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for cooling electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance (Flow)** | 1.15 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 2.50 °C/W (Unducted) | | **Weight** | 108 grams | --- ### 2. Design Features #### A. Fin Pattern (Straight Fin) This model uses a **straight fin** design. Straight fins provide a low pressure drop and are highly efficient in high-velocity airflow environments (ducted airflow). #### B. pushPIN™ Attachment Unlike adhesive tapes or clips, the pushPIN™ system provides several advantages: * **Constant Pressure:** Ensures a firm interface between the chip and the heat sink for optimal heat transfer. * **Vibration Resistance:** Securely locks into pre-drilled holes on the PCB. * **Standard Spacing:** Uses standard hole patterns (usually 38mm or similar depending on the specific assembly) to ensure compatibility. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the heat sink comes with **T412** thermal tape or a pre-applied thermal phase-change material, ensuring high conductivity from the component to the aluminum fins. --- ### 3. Part Number Breakdown (Nomenclature) To understand the specific configuration, the part number can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18:** Series/Specific internal identifier. * **D:** Package or specialized mounting type. * **71:** Specific height/configuration code (30mm). * **C3:** Finish/Material code (Blue Anodized). * **R0:** Revision or Thermal Interface Material (TIM) type. --- ### 4. Applications The ATS-18D-71-C3-R0 is commonly used in: * **Telecommunications:** Cooling routers and switches. * **Industrial Computing:** High-power CPUs or FPGAs. * **Power Supplies:** Managing heat in MOSFET arrays.