The **ATS-18D-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific data regarding its dimensions, performance, and material properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.10°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Spring Type** | ATS-PPS-18 | --- ### 2. Design and Construction #### A. Fin Geometry This model features **Straight Fins**. This design is optimized for environments with high-velocity airflow from a specific direction. The vertical fins provide a large surface area for heat to transfer from the aluminum body into the passing air. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; the anodization process creates an oxide layer that increases corrosion resistance and slightly improves surface emissivity for better radiant heat transfer. #### C. Attachment (pushPIN™) The "18D" in the part number indicates a specific push-pin system. This allows for: * **Constant Pressure:** A high-performance compression spring ensures the heat sink maintains steady contact with the electronic chip. * **Easy Installation:** No specialized tools are required; the pins snap into pre-drilled holes on the PCB. --- ### 3. Performance Characteristics The thermal efficiency of the ATS-18D-72-C3-R0 is highly dependent on airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 5.10 | | **200 (Unducted)** | 1.76 | | **400 (Unducted)** | 1.15 | | **600 (Unducted)** | 0.90 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied thermal interface material. This ensures that the microscopic gaps between the heat sink base and the electronic component are filled, minimizing the thermal contact resistance and maximizing heat flow.