The **ATS-18D-78-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. General Product Specifications This part belongs to the **maxiFLOW™** series, designed for high-performance cooling of electronic components like CPUs, GPUs, and FPGAs. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18D-78-C2-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins with Stainless Steel Springs) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for ensuring the part fits onto a Printed Circuit Board (PCB) without interfering with other surface-mount devices (SMD). * **Size (LxWxH):** 27mm x 27mm x 25mm * **Fin Style:** Straight Fin (maxiFLOW™ design) * **Pin-to-Pin distance:** Standardized for 27mm square chips. --- ### 3. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 7.70 °C/W | | **200 LFM (1.0 m/s)** | 4.70 °C/W | | **400 LFM (2.0 m/s)** | 3.10 °C/W | | **600 LFM (3.0 m/s)** | 2.50 °C/W | --- ### 4. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Design The "maxiFLOW" geometry features a spread fin structure. This increases the surface area for heat exchange while reducing pressure drop, making it highly effective in systems with forced-air cooling (fans). #### B. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system: * **Reliability:** Provides constant pressure for optimal thermal contact. * **Ease of Install:** Flexible spring-loaded pins snap into pre-drilled PCB holes. #### C. T766 Thermal Interface Material The part comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the semiconductor die and the aluminum heat sink, ensuring maximum heat transfer. --- ### 5. Common Applications * **Embedded Systems:** Cooling small-form-factor industrial PCs. * **Networking:** Cooling high-speed chips in routers and switches. * **Power Electronics:** Dissipating heat from voltage regulators or transistors.