The **ATS-18D-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.21°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Components & Design Electronic parts of this nature rely on mechanical design to influence electrical performance: * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T412**, a high-efficiency thermal tape or paste, which fills microscopic air gaps between the component and the heat sink. * **Push-Pin Mounting:** Unlike adhesive-only sinks, this uses a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force), which is critical for consistent thermal conductivity. * **AL6063 Alloy:** This specific aluminum alloy is chosen for its high thermal conductivity and lightweight properties, ensuring it doesn't stress the PCB. --- ### 3. Usage Context In an electronic system, the ATS-18D-80-C3-R0 is typically used for: 1. **High-Density PCBs:** Where space is limited to a 30mm footprint. 2. **Active Airflow Environments:** The straight-fin design is optimized for systems with fans (forced air cooling). 3. **Power Management:** Often found on VRMs (Voltage Regulator Modules) or embedded processors. --- ### 4. Thermal Performance Data Performance varies based on the airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 7.21 | 3.16 | 2.33 | 1.97 |