The **ATS-18D-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum (Al 6063) | | **Finish** | Blue Anodized | | **Dimensions (LxW)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Pitch / Pattern** | 40.00 mm (Diagonal / Hole spacing) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.67 °C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ## 2. Component Analysis ### A. Material and Coating * **Aluminum 6063:** This alloy is widely used in electronics due to its high thermal conductivity and excellent structural strength. * **Blue Anodizing:** This chemical treatment increases corrosion resistance and enhances the emissivity of the surface, slightly improving heat dissipation through radiation. ### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **ATS-18D-88-C2-R0** uses a specialized mechanical attachment: * **Springs:** Provides consistent pressure (Force) across the chip surface to ensure an even thermal interface. * **Brass Bolts/Pins:** These pass through pre-drilled holes in the PCB for a secure, vibration-resistant mount. ### C. Thermal Performance The "C2" in the part number indicates a specific thermal interface material (TIM) or configuration. This heat sink is designed for **forced air cooling** environments. Its thermal resistance decreases significantly as airflow (measured in Linear Feet per Minute - LFM) increases: * **@ 100 LFM (0.5 m/s):** 6.67 °C/W * **@ 700 LFM (3.5 m/s):** 1.33 °C/W --- ## 3. Applications This part is typically used for cooling: 1. **Processors (CPUs/GPUs):** Small to medium-sized embedded processors. 2. **FPGAs:** Field Programmable Gate Arrays that generate moderate heat. 3. **ASICs:** Application-Specific Integrated Circuits in networking equipment. 4. **Power Electronics:** Transistors and VRMs that require mechanical stability. ---