The **ATS-18D-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.49°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (H)** | 25mm | | **Pattern** | 48-Fin (High flow design) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System This part utilizes a specialized mounting mechanism. Instead of relying on messy thermal adhesives, it uses: * **Compression Springs:** Provide precise pressure to ensure optimal contact with the heat source. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves thermal emissivity. #### C. Fin Geometry The "94" series typically refers to the **Straight Fin** or **Cross-Cut** design. This allows for: * **Bidirectional Airflow:** Works well in systems where air might come from different angles. * **Low Pressure Drop:** Ensures that the cooling fan doesn't have to work excessively hard to push air through the fins. --- ### 3. Thermal Performance Summary In electronics, thermal resistance ($R_{th}$) determines how effectively the part moves heat away from the silicon. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 4.49 | | 300 (Moderate) | 1.82 | | 500 (High) | 1.45 | --- ### 4. Application Use-Cases This specific heat sink is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or IGBT modules.