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  • ATS-18E-01-C2-R0

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    The **ATS-18E-01-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their "push pin" attachment series. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18E-01-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.93°C/W (at 200 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | | **Dimensions (L x W x H)** | 40mm x 40mm x 6mm | --- ## 🧩 Key Components and Design Features ### 1. The Heat Sink Body * **Material:** Made from high-grade aluminum for optimal thermal conductivity. * **Low Profile:** With a height of only **6mm**, it is designed for space-constrained electronic assemblies (1U servers or thin clients). * **Fin Pattern:** Features a straight-fin design which is optimized for forced air cooling (airflow from a fan). ### 2. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses a **push-pin and compression spring** system. * **Reliability:** Provides consistent pressure on the processor, ensuring maximum heat transfer. * **Hardware:** Includes brass push-pins and stainless steel springs to resist vibration and mechanical shock. ### 3. Thermal Interface Material (TIM) * The "C2" in the part number indicates that the unit typically comes with **pre-applied thermal interface material**. * This ensures a low-resistance thermal path between the electronic component (like a CPU, GPU, or FPGA) and the aluminum base. ### 4. Blue Anodized Finish * The finish is not just aesthetic; anodizing increases the surface emissivity and protects the aluminum from environmental corrosion. --- ## 💻 Typical Applications This part is commonly found in: * **Networking Hardware:** Switches and routers. * **Embedded Systems:** Industrial PCs where vertical space is limited. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Small Form Factor (SFF) Computing:** Cooling chipsets on motherboards. ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern spacing required for the push-pin installation?
    • ⤷ How does the thermal resistance change at higher airflows (LFM)?
    • ⤷ Are there alternative heights available for the ATS-18E series?