The **ATS-18E-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 2.85°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Finish** | Blue Anodized | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Component Breakdown ### A. The Heat Sink Body The part features a **Square Pin Fin** design. Unlike straight fins, pin fins allow for multidirectional airflow, making them highly efficient in restricted spaces or where airflow direction is inconsistent. ### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Springs:** Provides consistent downward pressure (compression) on the component to ensure maximum contact with the heat source. ### C. Thermal Interface Material (TIM) The suffix `-C2` indicates that it comes with **T766 thermal grease** pre-applied to the base. This eliminates the need for manual application and ensures there are no microscopic air gaps between the chip and the aluminum. --- ## 3. Decoding the Part Number | Segment | Meaning | | :--- | :--- | | **ATS-18** | Refers to the specific series and mounting hole spacing. | | **E** | Indicates the material or specific manufacturing batch. | | **63** | Designates the specific fin pattern and size profile. | | **C2** | Thermal Interface Material type (T766 Grease). | | **R0** | RoHS compliance and revision status. | --- ## 4. Usage Considerations * **PCB Space:** Requires 40mm x 40mm of surface area and clearance for the push-pin holes. * **Airflow:** Optimized for "Low Flow" environments but scales performance with increased CFM (Cubic Feet per Minute). * **Compliance:** Fully RoHS and REACH compliant, making it suitable for modern industrial and consumer electronics.