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  • ATS-18E-65-C2-R0

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    The **ATS-18E-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and material properties. | Specification | Details | | :--- | :--- | | **Part Number** | ATS-18E-65-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | Approx. 7.22 °C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Pattern** | Square Fin (Cross-cut) | --- ### 2. Design Features * **Fin Style:** It utilizes a **Cross-cut (Square Pin)** fin pattern. This design is highly effective in environments where the direction of airflow is inconsistent (multi-directional airflow), as it allows air to pass through from multiple angles. * **pushPIN™ Attachment:** The "18E" designation refers to the specific attachment kit. This uses a plastic or brass pin with a stainless steel spring to provide a precise, consistent pressure (load) on the electronic component (like a CPU or FPGA). * **Thermal Interface Material (TIM):** The "C2" suffix typically denotes that the heat sink comes with a pre-applied thermal interface material (T-PCM 585 or similar) to ensure efficient heat transfer from the chip to the aluminum base. --- ### 3. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking processors. 2. **Data Centers:** Managing thermals for server components. 3. **Industrial Controls:** Cooling power modules that operate in constrained spaces. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Velocity) measured in Linear Feet per Minute (LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.22 | | 200 (1.0 m/s) | 4.25 | | 300 (1.5 m/s) | 3.38 | | 400 (2.0 m/s) | 2.91 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate the required LFM for my specific processor heat load?
    • ⤷ Can the pushPIN attachment be reused if the heat sink is removed?