ATS-18E-65-C2-R0
AI

The **ATS-18E-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications.
---
### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define the dimensions and material properties.
| Specification | Details |
| :--- | :--- |
| **Part Number** | ATS-18E-65-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | Approx. 7.22 °C/W (Unducted Flow @ 100 LFM) |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 25mm |
| **Fin Pattern** | Square Fin (Cross-cut) |
---
### 2. Design Features
* **Fin Style:** It utilizes a **Cross-cut (Square Pin)** fin pattern. This design is highly effective in environments where the direction of airflow is inconsistent (multi-directional airflow), as it allows air to pass through from multiple angles.
* **pushPIN™ Attachment:** The "18E" designation refers to the specific attachment kit. This uses a plastic or brass pin with a stainless steel spring to provide a precise, consistent pressure (load) on the electronic component (like a CPU or FPGA).
* **Thermal Interface Material (TIM):** The "C2" suffix typically denotes that the heat sink comes with a pre-applied thermal interface material (T-PCM 585 or similar) to ensure efficient heat transfer from the chip to the aluminum base.
---
### 3. Applications
This part is commonly used in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed networking processors.
2. **Data Centers:** Managing thermals for server components.
3. **Industrial Controls:** Cooling power modules that operate in constrained spaces.
---
### 4. Thermal Performance Data
Performance varies based on the Airflow (Velocity) measured in Linear Feet per Minute (LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 7.22 |
| 200 (1.0 m/s) | 4.25 |
| 300 (1.5 m/s) | 3.38 |
| 400 (2.0 m/s) | 2.91 |
- ⤷
What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate the required LFM for my specific processor heat load?
- ⤷ Can the pushPIN attachment be reused if the heat sink is removed?