### Overview of ATS-18E-72-C2-R0 The **ATS-18E-72-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for high-density electronic cooling applications where space is limited and thermal efficiency is critical. --- ### Key Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18E-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Thermal Resistance** | 1.30°C/W (at 200 LFM) | | **Fin Type** | Straight Fin | --- ### Component Breakdown #### 1. The Heat Sink Body The physical structure is made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "Straight Fin" design provides a large surface area for heat dissipation, making it ideal for systems with a steady airflow (forced convection). #### 2. The pushPIN™ Attachment System Instead of using messy thermal adhesives or tapes, this model uses the **pushPIN™ system**. * **Springs:** Provides a precise amount of downward pressure (compression) to ensure maximum contact between the chip and the heat sink. * **Plastic/Brass Push Pins:** Secure the assembly to pre-drilled holes on the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal grease. This eliminates the need for manual paste application, ensuring a uniform layer that reduces the air gaps between the component and the sink. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * Increased surface emissivity (improving radiation cooling). * Corrosion resistance. * Electrical insulation for the aluminum surface. --- ### Applications * **Processors (CPUs/GPUs):** For high-heat chips in industrial computers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Telecommunications:** Cooling FPGA and ASIC chips in rack-mounted servers. ---