Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18E-76-C2-R0

  • AI
    The **ATS-18E-76-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, designed for cooling electronic components such as ICs, CPUs, and GPUs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 15mm | | **Fin Pattern** | Fine-Pitch (Cross-Cut) | --- ### 2. Physical Design Features The ATS-18E-76-C2-R0 is engineered for maximum heat dissipation within a small footprint: * **Cross-Cut Fin Design:** The fins are not continuous rails; they are cut into a grid pattern. This increases surface area and allows for better airflow from multiple directions (omni-directional). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. This provides consistent pressure (TIM - Thermal Interface Material compression) and prevents the heat sink from shifting during vibration or transport. * **Material Choice:** Using 6063 aluminum provides a balance between high thermal conductivity and structural rigidity. --- ### 3. Thermal Performance Analysis Thermal resistance determines how effectively the part moves heat away from the silicon die. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 100 (0.5 m/s) | 11.57 | | 300 (1.5 m/s) | 4.42 | | 500 (2.5 m/s) | 3.17 | | 700 (3.5 m/s) | 2.58 | --- ### 4. Part Number Breakdown The suffix `C2-R0` indicates specific customization: * **C2:** Refers to the Thermal Interface Material (TIM) pre-applied to the base (usually T766 or similar high-performance grease/pad). * **R0:** Indicates the revision or RoHS compliance status. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for the push-pin mounting of this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal radiation properties compared to a bare aluminum finish?
    • ⤷ What are the recommended Thermal Interface Materials (TIM) to use if the pre-applied one is removed?