ATS-18E-76-C2-R0
AI

The **ATS-18E-76-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, designed for cooling electronic components such as ICs, CPUs, and GPUs.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 15mm |
| **Fin Pattern** | Fine-Pitch (Cross-Cut) |
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### 2. Physical Design Features
The ATS-18E-76-C2-R0 is engineered for maximum heat dissipation within a small footprint:
* **Cross-Cut Fin Design:** The fins are not continuous rails; they are cut into a grid pattern. This increases surface area and allows for better airflow from multiple directions (omni-directional).
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. This provides consistent pressure (TIM - Thermal Interface Material compression) and prevents the heat sink from shifting during vibration or transport.
* **Material Choice:** Using 6063 aluminum provides a balance between high thermal conductivity and structural rigidity.
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### 3. Thermal Performance Analysis
Thermal resistance determines how effectively the part moves heat away from the silicon die.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
|:---|:---|
| 100 (0.5 m/s) | 11.57 |
| 300 (1.5 m/s) | 4.42 |
| 500 (2.5 m/s) | 3.17 |
| 700 (3.5 m/s) | 2.58 |
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### 4. Part Number Breakdown
The suffix `C2-R0` indicates specific customization:
* **C2:** Refers to the Thermal Interface Material (TIM) pre-applied to the base (usually T766 or similar high-performance grease/pad).
* **R0:** Indicates the revision or RoHS compliance status.
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- ⤷
What are the specific hole patterns required on the PCB for the push-pin mounting of this heat sink?
- ⤷ How does the 'Blue Anodized' finish affect the thermal radiation properties compared to a bare aluminum finish?
- ⤷ What are the recommended Thermal Interface Materials (TIM) to use if the pre-applied one is removed?