The **ATS-18E-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ## 1. Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Part Number** | ATS-18E-89-C2-R0 | Series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances surface durability and emissivity | | **Attachment Method** | Push-Pin | Secure mechanical fastening | | **Thermal Resistance** | 3.94 °C/W (at 100 LFM) | Rate of heat dissipation per watt | | **Dimensions** | 35mm x 35mm | Base footprint | | **Height** | 30mm | Vertical clearance required | --- ## 2. Key Design Features ### Thermal Performance The "C2" in the part number indicates a specific thermal interface material or performance grade. This heat sink is designed for **forced air cooling** environments. As airflow (measured in Linear Feet per Minute - LFM) increases, the thermal resistance drops significantly: * **100 LFM:** 3.94 °C/W * **700 LFM:** 1.01 °C/W ### pushPIN™ Attachment System Unlike adhesive-based heat sinks, the ATS-18E-89-C2-R0 uses a **Push-Pin and Spring** mechanism. * **Reliability:** Provides consistent pressure (preload) for better thermal contact. * **Ease of Assembly:** Can be installed quickly on PCBs with pre-drilled holes. * **Securement:** Better suited for high-vibration environments compared to thermal tape. ### Fin Profile (Straight Fin) This model utilizes a **straight fin** design. Straight fins are optimized for directional airflow, allowing air to pass through the channels with low pressure drop, effectively stripping heat away from the aluminum surface. --- ## 3. Electronic Application & Usage This component is typically used to cool high-heat-generating integrated circuits (ICs) such as: 1. **Processors (CPUs/MPUs):** Small embedded processors in industrial or networking gear. 2. **ASICs & FPGAs:** Custom logic chips that operate at high frequencies. 3. **Power Electronics:** Voltage regulators or MOSFETs that require a 35x35mm cooling footprint. ### Compatibility Checklist Before integrating this part, ensure the following: * **PCB Hole Pattern:** The board must have holes matching the push-pin pitch. * **Vertical Clearance:** Ensure no other components interfere with the 30mm height. * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied thermal pad or requires high-quality thermal paste to bridge the gap between the chip and the aluminum base. ---