The **ATS-18F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, which is engineered for securing thermal solutions to Printed Circuit Boards (PCBs) with high reliability. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 25.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Pitch (Fins)** | Fine Pitch | | **Pattern** | XC-CUT (Cross-Cut) | | **Thermal Resistance** | 11.51 °C/W (Unducted) @ 100 LFM | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18**: Series identifier (Standard series for pushPIN™). * **F**: Fin attachment style (indicates specific geometry). * **05**: Specific size/footprint code. * **C2**: Thermal Interface Material (TIM) type (T766 - High-performance thermal grease). * **R0**: RoHS compliance and revision status. --- ### 3. Key Component Features #### A. XC-CUT Fin Design The "XC-CUT" refers to the cross-cut pattern in the fins. Unlike straight fins, these provide a larger surface area and allow for multi-directional airflow. This makes the heatsink highly efficient in systems where the direction of the cooling fan's exhaust might vary. #### B. pushPIN™ Attachment Instead of using messy adhesives or permanent solder, this part uses a mechanical "pushPIN" system: * **Compression Springs:** Ensure consistent pressure is applied to the electronic component (CPU, GPU, or FPGA), maximizing heat transfer. * **Plastic/Brass Pins:** Secure the heatsink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The **C2** designation indicates that the heatsink comes pre-applied with **ATS-T766**. This is a thermal grease designed to fill microscopic air gaps between the component and the heatsink, significantly reducing thermal resistance. --- ### 4. Typical Applications This component is commonly used to cool: 1. **Processors:** CPUs and high-speed DSPs. 2. **Power Electronics:** MOSFETs and Power ICs. 3. **Network Hardware:** High-speed routers and switches where airflow is often turbulent.