The **ATS-18F-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Unducted)** | 16.97 °C/W @ 100 LFM | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Pattern** | Fine-Pitch (Straight Fin) | --- ### Key Electronic & Mechanical Features #### 1. Push-Pin Mounting System This part uses a specific "push-pin" mechanism rather than thermal adhesive. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the electronic chip. * **Reliability:** Mechanical fasteners are less prone to failure over time compared to tapes or glues in high-vibration environments. #### 2. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied thermal interface material**. This is a conductive phase-change material or grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. #### 3. Material Properties * **Aluminum Construction:** Offers a balance between high thermal conductivity and low weight. * **Blue Anodized Coating:** Provides corrosion resistance and increases the surface emissivity, slightly improving radiative heat transfer. --- ### Typical Applications * **Integrated Circuits (ICs):** Cooling microprocessors or ASICs. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Telecommunications:** Used in routers and switches where airflow is often directed through a chassis.