The **ATS-18F-10-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18F-10-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive/Active Cooling Support) | | **Fin Style** | XC-Cut (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | --- ### 2. Design Characteristics #### A. Fin Pattern (XC-Cut) The "F" in the part number denotes a **Cross-Cut** fin design. Unlike straight-fin heat sinks, XC-cut fins allow for multi-directional airflow. This makes the unit highly effective in systems where the direction of the cooling fan's exhaust might vary or be turbulent. #### B. Attachment Mechanism (Push-Pin) This model uses a **Push-Pin** system with a built-in spring. * **Ease of Assembly:** No special tools are required; the pins snap into pre-drilled holes in the PCB. * **Consistent Pressure:** The spring ensures that a specific amount of downward force is applied to the component, optimizing the thermal interface material (TIM) performance. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with a **Thermal Tape** or phase-change material (specifically ATS's T766 or similar high-performance compound), which simplifies the installation process. --- ### 3. Applications The ATS-18F-10-C2-R0 is commonly used in industrial and telecommunication hardware, including: * **Networking Gear:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. --- ### 4. Thermal Performance Data Thermal resistance measures how effectively the heat sink transfers heat away from the chip. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.92 | | 300 (1.5 m/s) | 5.92 | | 500 (2.5 m/s) | 4.31 | ---