The **ATS-18F-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of their "push-pin" series designed for secure attachment to PCBs. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Type** | Fine-Pitch (Cross-cut) | | **Thermal Resistance** | 4.84°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Component Breakdown ### 1. Fin Design The "18F" in the part number indicates a specific fin density and arrangement. These are **cross-cut fins**, which allow for multi-directional airflow. This is critical in cramped electronic enclosures where airflow might not be strictly linear. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **R0** designation indicates a push-pin attachment system with a brass or plastic spring. * **Advantage:** Provides consistent pressure (clamping force) on the high-power component (CPU, GPU, or ASIC), ensuring optimal heat transfer through the TIM. * **Reliability:** It is more resistant to shock and vibration than "peel-and-stick" tape solutions. ### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink base and the electronic component, significantly reducing contact resistance. ### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases surface emissivity (improving radiant heat transfer) and provides corrosion resistance. --- ### ## Applications This specific size (45mm) is commonly used for: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Cooling embedded CPUs. * **Power Supplies:** Dissipating heat from MOSFETs or bridge rectifiers.