The **ATS-18F-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number encodes specific data about the heat sink's physical properties and performance: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-110-C2-R1 | | **Fin Type** | Push-Pin (Straight Fin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.69°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Thermal Interface Material** | Pre-applied T766 (Phase change material) | --- ## 2. Structural Design Features The "push-pin" design is critical for electronic assemblies. Here is how the components function: ### A. Fin Geometry (Straight Fin) The straight-fin design is optimized for **forced air cooling**. It allows air from a system fan to flow through the channels with minimal pressure drop, effectively stripping heat away from the aluminum surface. ### B. Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this model uses a **brass/plastic push-pin and spring system**. * **Uniform Pressure:** The springs ensure that the heat sink is pressed against the component with consistent force. * **Reliability:** It prevents the heat sink from shifting during vibration or mechanical shock. ### C. Thermal Interface Material (TIM) The base comes with **T766** pre-applied. This is a high-performance "Phase Change" material that softens as it reaches operating temperature, filling microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ## 3. Dimensional Data Precise physical dimensions are required for PCB layout planning: * **Width/Length:** 54.00 mm x 54.00 mm * **Height:** 25.00 mm (Low profile for 1U or 2U chassis) * **Pin Pitch:** Detailed spacing for specific hole patterns on the PCB. --- ## 4. Typical Applications This part is commonly found in industrial and high-end computing environments: 1. **Telecommunications:** Cooling of ASICs in network switches. 2. **Embedded Computing:** High-speed processors in industrial PCs. 3. **Power Electronics:** Cooling of large MOSFET arrays or IGBTs.