## Electronic Part Analysis: ATS-18F-113-C2-R0 The **ATS-18F-113-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.79°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | | **Dimensions** | 45.00mm x 45.00mm x 10.00mm | --- ### 2. Component Design & Features #### Physical Architecture * **Fin Design:** It utilizes a **tapered fin** design, which increases the surface area while allowing for better airflow management compared to standard straight-fin heat sinks. * **Low Profile:** With a height of only 10mm, it is ideal for low-profile applications or enclosures where vertical space is limited. * **Thermal Interface Material (TIM):** The unit comes pre-applied with **T766**, a high-performance phase-change material that ensures minimal thermal resistance between the component and the heat sink. #### Attachment System (pushPIN™) The "R0" suffix denotes the specific mounting hardware. The **pushPIN™** system is designed for secure and rapid installation: * Includes a flexible spring-loaded mechanism. * Ensures consistent pressure across the component for optimal heat transfer. * Requires specific hole patterns on the PCB for installation. --- ### 3. Performance Metrics Thermal performance is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM** | 5.74 | | **200 LFM** | 2.79 | | **300 LFM** | 2.32 | | **400 LFM** | 2.03 | --- ### 4. Typical Applications * **Networking Hardware:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and power modules. * **ASICs/FPGAs:** Cooling custom logic chips in telecommunications.