The **ATS-18F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Ice" or "push-pin" series designed for thermal management in electronic systems. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 3.96°C/W (at 200 LFM) | | **Flow Orientation** | Straight Fin | | **Mounting Hole Pattern** | 33.0mm (Diagonal) | --- ### ## Component Breakdown #### 1. Thermal Dissipation (The Fin Design) The device uses a **Straight Fin** geometry. This design is optimized for environments where there is a clear, directional airflow (forced convection). The aluminum construction provides high thermal conductivity, drawing heat away from the semiconductor (CPU, FPGA, or GPU) and into the ambient air. #### 2. Mounting Mechanism: Push-Pins The "R0" designation refers to the mounting kit: * **Spring-loaded Push-Pins:** These provide a precise, consistent pressure against the electronic component, which improves the thermal interface material (TIM) performance. * **Compression Springs:** These ensure that the heat sink remains secure even under mechanical vibration or thermal expansion/contraction cycles. #### 3. Material and Finish * **Blue Anodized Finish:** Anodizing is not just for aesthetics; it provides surface protection against corrosion and slightly increases the emissivity of the surface, which aids in radiant heat transfer. --- ### ## Applications in Electronics This specific heat sink is typically found in: * **Networking Hardware:** Routers, switches, and access points. * **Embedded Systems:** Industrial PCs and motherboards. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Cooling high-speed data processing units. ---