The **ATS-18F-127-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height (H)** | 15.00mm | | **Thermal Resistance** | 3.84°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design: Straight Fin This model utilizes a **Straight Fin** geometry. This design is optimized for environments where there is a consistent, unidirectional airflow. It provides a low pressure drop and high surface area for heat transfer. #### B. Attachment: pushPIN™ System The "18F" series uses a mechanical push-pin attachment. * **Benefits:** Provides a secure, vibration-resistant connection to the PCB. * **Hardware:** It typically includes a brass or plastic pin and a compression spring to ensure even pressure across the component surface. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** This material fills microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal contact resistance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the component. Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 3.84 | | 300 | 1.59 | | 500 | 1.23 | | 700 (High) | 1.05 | --- ### 4. Typical Applications * **CPUs and GPUs:** Used in embedded systems or industrial PCs. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Cooling FPGA or ASIC chips in networking gear. ---