The **ATS-18F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power modules to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Al) | | **Base Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Fin Style** | XC (Cross-Cut) / Square | --- ### Key Design Features #### 1. PushPIN™ Attachment System This part uses a specific mounting mechanism designed to be fast, secure, and easy to install. * **Spring-loaded mechanism:** Ensures constant and high-performance pressure between the heat sink and the component. * **Compression Springs:** These provide the precise force required to optimize thermal contact while preventing damage to the PCB. #### 2. Cross-Cut (XC) Fin Design The "XC" in the design indicates a cross-cut fin pattern. * **Multi-directional Airflow:** Unlike straight-fin heat sinks, the cross-cut design allows airflow to enter from any direction, making it ideal for enclosures with irregular air patterns. * **Increased Surface Area:** The pattern increases the overall surface area for heat exchange without significantly increasing the footprint. #### 3. Material and Coating * **Aluminum Construction:** Offers a balance between thermal conductivity, weight, and cost. * **Blue Anodized Finish:** This is not just aesthetic; anodizing protects the aluminum from corrosion and slightly improves surface emissivity for radiation cooling. --- ### Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **18F** | Specific Series and Pin configuration | | **128** | Sequence/Design identifier | | **C2** | Thermal Interface Material (TIM) / Material Grade | | **R0** | Revision or Packaging code | --- ### Application Usage This heat sink is typically used in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** MOSFET or IGBT cooling. * **Automotive:** Electronic Control Units (ECUs).