ATS-18F-131-C2-R0
AI

The **ATS-18F-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" attachment series, specifically designed for cooling electronic components like BGA (Ball Grid Array) chips, CPUs, and GPUs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 60mm x 60mm |
| **Height** | 20mm |
| **Attachment Type** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | ~1.31°C/W (at 200 LFM) |
| **Fin Style** | XCUT (Straight Fin with cross-cuts) |
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### 2. Key Components & Construction
* **XCUT Fin Design:** This heat sink uses a cross-cut straight fin pattern. This design allows for multi-directional airflow, making it effective even if the air is not blowing directly parallel to the fins.
* **Push Pin Attachment:** It utilizes a brass push-pin mechanism. This provides a secure, tool-free connection to the Printed Circuit Board (PCB) through pre-drilled holes.
* **Thermal Interface Material (TIM):** The "R0" suffix typically indicates that the part comes with **T766** phase-change material or a similar thermal pad pre-applied to the base, ensuring optimal heat transfer from the chip to the aluminum.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides increased surface area at a microscopic level and protects the aluminum from corrosion.
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### 3. Application Use Cases
This specific model is commonly found in:
1. **Networking Hardware:** High-speed routers and switches.
2. **Industrial PCs:** Cooling embedded processors in fanless or forced-air environments.
3. **Power Supplies:** Managing heat for large MOSFETs or power ICs.
4. **Telecommunications:** Cooling FPGA and ASIC chips.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **18F:** Series designation (Push-Pin style)
* **131:** Specific size/footprint code
* **C2:** Material/Finish code (Blue Anodized)
* **R0:** Thermal interface material type
- ⤷
What are the required PCB hole diameters for the brass push pins?
- ⤷ How does the XCUT fin design compare to standard straight fins in terms of airflow?
- ⤷ Can this heat sink be used with custom thermal paste instead of the pre-applied TIM?