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  • ATS-18F-131-C2-R0

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    The **ATS-18F-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" attachment series, specifically designed for cooling electronic components like BGA (Ball Grid Array) chips, CPUs, and GPUs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 60mm x 60mm | | **Height** | 20mm | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~1.31°C/W (at 200 LFM) | | **Fin Style** | XCUT (Straight Fin with cross-cuts) | --- ### 2. Key Components & Construction * **XCUT Fin Design:** This heat sink uses a cross-cut straight fin pattern. This design allows for multi-directional airflow, making it effective even if the air is not blowing directly parallel to the fins. * **Push Pin Attachment:** It utilizes a brass push-pin mechanism. This provides a secure, tool-free connection to the Printed Circuit Board (PCB) through pre-drilled holes. * **Thermal Interface Material (TIM):** The "R0" suffix typically indicates that the part comes with **T766** phase-change material or a similar thermal pad pre-applied to the base, ensuring optimal heat transfer from the chip to the aluminum. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides increased surface area at a microscopic level and protects the aluminum from corrosion. --- ### 3. Application Use Cases This specific model is commonly found in: 1. **Networking Hardware:** High-speed routers and switches. 2. **Industrial PCs:** Cooling embedded processors in fanless or forced-air environments. 3. **Power Supplies:** Managing heat for large MOSFETs or power ICs. 4. **Telecommunications:** Cooling FPGA and ASIC chips. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18F:** Series designation (Push-Pin style) * **131:** Specific size/footprint code * **C2:** Material/Finish code (Blue Anodized) * **R0:** Thermal interface material type
    ✨ Follow-up Questions
    • ⤷ What are the required PCB hole diameters for the brass push pins?
    • ⤷ How does the XCUT fin design compare to standard straight fins in terms of airflow?
    • ⤷ Can this heat sink be used with custom thermal paste instead of the pre-applied TIM?