The **ATS-18F-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-133-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | | **Thermal Resistance** | 4.60°C/W (at 100 LFM) | | **Fin Type** | Fine Pitch (straight fins) | --- ## Key Components and Features ### 1. The Heat Sink Body The body is constructed from high-grade aluminum. Aluminum is preferred in electronics for its excellent balance between thermal conductivity, weight, and cost. The **Blue Anodized** coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. ### 2. pushPIN™ Attachment System This specific model uses the proprietary **pushPIN™** system. This is a critical electronic part because: * **Precision Springs:** It uses a compression spring to provide exact pressure (Force) on the chip, ensuring maximum contact with the thermal interface material (TIM). * **Secure Mounting:** It prevents the heat sink from shifting during vibration or shipping. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base. * **T766 Phase Change Material:** This is a high-performance pad that softens at operating temperatures to fill microscopic air gaps between the component and the heat sink. --- ## Application and Usage ### Where it is used: * **Integrated Circuits (ICs):** Specifically high-surface-area chips that require a low-profile cooling solution (only 10mm high). * **Networking Gear:** Routers and switches where airflow is directed across the PCB. * **Industrial Power Supplies:** To cool MOSFETs or voltage regulators. ### Installation Code Breakdown: ```text ATS - 18 - F - 133 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------- Dimensional Code (70x70mm) | | +------------------ Fin Pitch (Fine) | +----------------------- Series (pushPIN™) +---------------------------- Brand (Advanced Thermal Solutions) ```