The **ATS-18F-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure attachment to printed circuit boards (PCBs). ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Base Dimensions** | 70mm x 70mm | | **Height (Fin Height)** | 20mm | | **Thermal Resistance** | 0.88 °C/W (at 200 LFM) | | **Fin Pattern** | Cross-Cut | --- ### 2. Key Component Features * **High Performance:** The cross-cut fin design provides a large surface area for heat dissipation, making it suitable for high-power processors or ASICs. * **Push-Pin Mounting:** It uses a spring-loaded brass push-pin mechanism. This ensures a consistent pressure on the component, improving thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **SAINT-GOBAIN C8000**, which is a high-performance thermal phase change material. * **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity. --- ### 3. Part Number Breakdown The part number can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **18F** | Series/Mounting type (Push-pin family) | | **134** | Dimensional code (70x70mm footprint) | | **C2** | Performance/Material grade | | **R0** | Revision code / Specific packaging | --- ### 4. Application Example In a typical PCB design, this heat sink would be mounted over a BGA (Ball Grid Array) component. Below is a conceptual representation of the mounting hole layout logic in a CAD environment: ```python # Simplified representation of Mounting Hole Coordinates for a 70x70mm Sink # Typically, holes are offset from the center of the component chip_size = 70.0 hole_offset = 5.0 mounting_holes = [ {"x": -35.0 - hole_offset, "y": -35.0 - hole_offset}, {"x": 35.0 + hole_offset, "y": 35.0 + hole_offset} ] ```