The **ATS-18F-135-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic components like CPUs, GPUs, or power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 3.00°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 30mm | | **Fin Style** | Straight Fin | --- ### Component Breakdown #### 1. The Heat Sink Body * **Material:** Constructed from high-grade aluminum for optimal thermal conductivity. * **Design:** Features a "Fine Pitch" or straight fin design which increases the surface area, allowing heat to dissipate into the surrounding air more efficiently. * **Finish:** The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity. #### 2. The Attachment Mechanism (pushPIN™) This part uses a specific mechanical assembly to ensure a secure fit: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the electronic chip, ensuring maximum contact with the thermal interface material. #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically denotes that the heatsink comes pre-applied with **T766 thermal grease** or a similar high-performance phase-change material. This fills the microscopic air gaps between the chip and the heatsink base. --- ### Key Applications * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Telecommunications:** Managing heat in high-speed routers and switches. * **Embedded Systems:** Cooling processors in industrial computers where airflow might be restricted.