The **ATS-18F-141-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" push-pin heat sink series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-141-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 15.76°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Key Features 1. **High-Efficiency Fin Design**: The unit typically utilizes a **cross-cut** or **straight-fin** geometry. This design increases the surface area for heat dissipation while allowing for multi-directional airflow. 2. **Push-Pin Mounting**: Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. This provides higher pressure for better thermal contact and ensures the heat sink remains secure during shock or vibration. 3. **Pre-applied Thermal Interface Material (TIM)**: It comes with **T766** phase-change material already applied to the base. This eliminates the need for separate thermal paste and ensures a consistent, thin layer for optimal heat transfer. 4. **Blue Anodized Finish**: The blue anodization isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. --- ### ### Typical Applications * **Integrated Circuits (ICs)**: Cooling small processors or chipsets. * **Power Electronics**: Heat dissipation for MOSFETs or voltage regulators. * **Networking Hardware**: Cooling components in routers, switches, and servers where space is limited but thermal loads are high. --- ### ### Installation Example ```markdown 1. Align the push-pins with the pre-drilled holes in the PCB. 2. Press down on the pins until the spring-loaded mechanism snaps into place. 3. The T766 TIM will fill the microscopic gaps between the chip and the aluminum base. ```