The **ATS-18F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like BGA, FPGA, or CPUs to ensure stability and longevity. --- ## 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal performance, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | --- ## 2. Key Component Features ### A. Material and Coating The unit is crafted from high-grade aluminum. It features a **Blue Anodized** finish, which is not just aesthetic; it improves surface emissivity and protects the aluminum from oxidation and corrosion. ### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system: * **Compression Springs:** Provides precise, uniform pressure across the thermal interface. * **Plastic Pins:** Designed to fit into pre-drilled holes (approx. 3.0mm) on the PCB. * **Reliability:** Mechanical mounting is superior to adhesives in high-vibration or high-heat environments where glue might fail. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance thermal phase-change material. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the sink. --- ## 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure. | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 13.65°C/W | 7.69°C/W | 5.73°C/W | | **Thermal Resistance (Ducted)** | 6.62°C/W | 4.32°C/W | 3.51°C/W | --- ## 4. Common Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules. * **Consumer Electronics:** Set-top boxes and gaming hardware.